HiFiRep
atmire.item.type | Project | |
dc.accessRights | Anonymous | |
dc.contributor | Kristiansen, Per Magnus | |
dc.contributor | Rytka, Christian | |
dc.date.accessioned | 2019-11-14T09:18:31Z | |
dc.date.available | 2019-11-14T09:18:31Z | |
dc.description.abstract | Both for technical and cost reasons, the transfer of periodic micro- or nanopatterns into polymer surfaces is done by nanoimprint lithography or nano-injection molding using Silicon or nickel masters. These processes are still embryonic on the nanometer scale and need substantial research to become mature for applications. It is the aim of this project to solve these technological challenges which requires a deep and detailed understanding of the mold filling process on the nanometer scale as well as the effects during the demoldingprocess. The project will focus on solving homogeneity issues, i.e. the level of replication fidelity over large (~10cm) areas, on replication of high-aspect structures (>2) and on problems associated withdemolding. Finally the replication of ultra-small structures (<10nm) will be addressed using masters froma new exposure facility currently being set up at PSSSSSSSI-SLS. The success of this project and any knowledge generated in therein will help a young... | |
dc.identifier.uri | https://irf.fhnw.ch/handle/11654/28450 | |
dc.subject.ddc | 005 - Computer Programmierung, Programme und Daten | |
dc.title | HiFiRep | |
dc.type | 00 - Projekt | |
dspace.entity.type | Project | |
fhnw.Project.Contact | Kristiansen, Per Magnus | |
fhnw.Project.End | 2011-12-01 | |
fhnw.Project.Finance | Swiss Nanoscience Institute (SNI) | en_US |
fhnw.Project.Manager | Kristiansen, Per Magnus | |
fhnw.Project.Start | 2010-01-01 | |
fhnw.Project.State | abgeschlossen | de |
fhnw.Project.Type | angewandte Forschung | |
fhnw.Project.resea | t416-0025 | |
fhnw.affiliation.hochschule | Hochschule für Technik und Umwelt FHNW | de_CH |
fhnw.affiliation.institut | Institut für Nanotechnische Kunststoffanwendungen | de_CH |
fhnw.project.id | 421 | |
fhnw.sap.reference | t416-0025 | |
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