Three-dimensional microstructure of thin copper foils revealed by ion beam cutting and electron backscatter diffraction (EBSD)
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Autor:innen
Autor:in (Körperschaft)
Publikationsdatum
07.2005
Typ der Arbeit
Studiengang
Typ
04B - Beitrag Konferenzschrift
Herausgeber:innen
Herausgeber:in (Körperschaft)
Betreuer:in
Übergeordnetes Werk
Texture and anisotropy of polycrystals II. ITAP 2. Proceedings of the International Conference on Texture and Anisotropy of Polycrystals (ITAP 2)
Themenheft
DOI der Originalpublikation
Link
Reihe / Serie
Solid State Phnenomena
Reihennummer
105
Jahrgang / Band
Ausgabe / Nummer
Seiten / Dauer
Patentnummer
Verlag / Herausgebende Institution
Trans Tech Publications, Ltd.
Verlagsort / Veranstaltungsort
Metz
Auflage
Version
Programmiersprache
Abtretungsempfänger:in
Praxispartner:in/Auftraggeber:in
Zusammenfassung
Tensile testing of thin rolled copper foils with thickness ranging from 10 to 250 µm shows a dependence of the fracture strain with respect to the thickness of the foils [G. Simons et al., in Solid Mechanics and its Applications, Vol. 114 (2004), pp. 89-96]. To understand the influence of the microstructure in the foils on this phenomenon the microtexture is investigated by orientation mapping through electron backscatter diffraction (EBSD). As the samples are rather small standard preparation techniques do not apply. Two methods are described which allow the investigation of different section cuts of the samples: Cross sections of the samples were produced by ion beam cutting with a wide beam of 7 keV Kr ions. Internal planes parallel to the specimen surface were made accessible by wet etching. The as-received material possesses a very strong texture consisting mostly of the cube component and some remnants of a previous rolling texture. Specimens tested in a tensile test do not show major microstructural changes compared to virgin samples. After a heat treatment at 300°C the cube texture has significantly weakened in favour of revived rolling components, and the fracture strain increased about ten times relative to the as-is material.
Schlagwörter
Fachgebiet (DDC)
Veranstaltung
2nd International Conference on Texture and Anisotropy of Polycrystals (ITAP 2)
Startdatum der Ausstellung
Enddatum der Ausstellung
Startdatum der Konferenz
07.07.2004
Enddatum der Konferenz
09.07.2004
Datum der letzten Prüfung
ISBN
3908451094
ISSN
1662-9779
Sprache
Englisch
Während FHNW Zugehörigkeit erstellt
Nein
Zukunftsfelder FHNW
Publikationsstatus
Veröffentlicht
Begutachtung
Peer-Review des Abstracts
Open Access-Status
Closed
Lizenz
Zitation
Simons, G., Kunze, K., Hauffe, W., & Dual, J. (2005). Three-dimensional microstructure of thin copper foils revealed by ion beam cutting and electron backscatter diffraction (EBSD). In C. Esling, M. Humbert, R. A. Schwarzer, & F. Wagner (Eds.), Texture and anisotropy of polycrystals II. ITAP 2. Proceedings of the International Conference on Texture and Anisotropy of Polycrystals (ITAP 2). Trans Tech Publications, Ltd. https://doi.org/10.4028/www.scientific.net/ssp.105.465